The details
DG06 Lansing will use state-of-the-art tri-density heat removal infrastructure, with Rear Door, Direct-to-Chip, and Immersion cooling systems, supporting up to 400-600 kW+ per chassis next-generation GPU installations.
The facility will transport heat energy to the Lansing Board of Water and Light On-Campus Heat Exchange platform, saving $1.78million of costs and avoiding 14.12k tCO2 in Scope 1 emissions every year.
General
Number of data floors: 1
Separate delivery bays: 4 modules
Target PUE: <1.17
Containerised
100 racks per module
Up to 600kW/rack
Networking
Fully deployed Internet Exchange and Cloud Ramp with diverse fibre routes.
Low-latency carrier-neutral scalable 800Gb connectivity
Connected Carriers: 10+
Fire detection & Suppression
Novec Pre-action Fire Suppression System
Security
Electronic Access Control: 7 Tier Security Perimeter with 2-Form Biometric controlled access security system.
Fully integrated internal and external CCTV, Audited
24/7 Security / Facility Operations Control Center: Staffed 24*7 * 365 with facility-wide integrated CCTV Monitoring meeting SOC2, ISO 27001, FEDRAMP Medium Controls and NIST-53 standards
Power
Total incoming feed capacity (kVA): 24MVA
Available power: 20 kW
Generator fuel at full load (hours): 240
UPS (minutes): 5
UPS redundancy: N+1
Generator redundancy: N+1
Cooling: N+1 (Heat reuse, Expansion chillers & Air Cooled Free Cooling Chiller)